IMEC VZWHeverleeTED
WAFER OPPERVLAKTE DEELTJESSCANNER
WAFER OPPERVLAKTE DEELTJESSCANNER
No credit card · Instant access
Content at a glance
- Tender type:
- Tender
- Contracting authority:
- IMEC VZW
- Published:
- March 30, 2026
- Deadline:
- April 30, 2026
Tender description
WAFER OPPERVLAKTE DEELTJESSCANNER
Further details
With free access, documents, deadlines and submission notes are available in a structured format.
- Core requirements of the tender prioritized and prepared
- Deadlines, eligibility criteria and documents in one workflow
- Guidance for structured bid preparation
- Automatically discover matching follow-up tenders
30 days free · no credit card · cancel anytime
All procurement details
Buyer, lots, participants, locations, documents, and procedure data have already been captured. Open any area to see the complete information in your workspace.
6 data areas available
30 days free · no credit card · cancel anytime
Documents
Unlock49 details capturedDocuments
Buyer
Unlock3 details capturedBuyer · Address · Contact
Lots
Unlock1 detail capturedLots LOT-0001
Procedure data
Unlock5 details capturedPublication number · Procedure reference · Procedure type · Contract type · +1 more
Performance locations
Unlock2 details capturedPerformance locations
Publisher
Unlock3 details capturedPublisher · Address · Contact
Related tenders
8Wafer Shape Metrology Tool
Imec EU Pilot line NVHeverleeWafer Shape Metrology Tool300 MM WAFER PLATFORM WITH SINGLE WAFER CHAMBERS CVD SI/POLY+ RTO/RTA
Imec EU Pilot line NVHeverleeDeadline: Apr 13300 MM WAFER PLATFORM WITH SINGLE WAFER CHAMBERS CVD SI/POLY+ RTO/RTAUnpatterned Wafer Inspection Tool Upgrade
Imec EU Pilot line NVHeverleeUnpatterned Wafer Inspection Tool Upgrade6", Galliumarsenid Wafer, semiisolierend
IAFBeschaffung von 6-Zoll-Galliumarsenid-Wafern in semiisolierender Ausführung.Upgrade für 6-Zoll-Wafer, IAF
IAFUpgrade von Anlagen für 6-Zoll-Wafer am Standort Freiburg im Breisgau.on-Wafer HF-Probes, Kalibriersubstrat und Kabel
IHP GmbH - Leibniz-Institut für innovative MikroelektronikDeadline: Mar 25on-Wafer HF-Probes, Kalibriersubstrat und KabelBeschaffung eines halbautomatischen Wafer-Metrologie-Systems für ISO 4 Reinraum
TEKNOLOGIAN TUTKIMUSKESKUS VTT OYVTTDeadline: May 29Beschaffung eines halbautomatischen Wafer-Metrologie-Systems zur Messung von Gesamtdicke, TTV, Warp, Bow, Metallisierungs-Bumps sowie Graben- oder Via-Tiefe. Geeignet für Halbleitersubstrate wie Silizium-Wafer, Chips, gestapelte Wafer/Chips sowie Proben mit Mischoxiden oder Dünnschichtabscheidungen. Das System muss für den Betrieb in einem Reinraum der Klasse ISO 4 ausgelegt sein.EPM-Upgrade auf 6" Wafer Prozessierung
IAFUpgrade der EPM-Anlage zur Ermöglichung einer 6-Zoll-Wafer-Prozessierung am Standort Freiburg, Baden-Württemberg.
Frequently asked questions about this tender
- How can I apply for this tender?
- Create a free account on Auftrag One. You will then see all documents, deadlines and submission notes in a structured workflow.
- What is the submission deadline?
- The submission deadline is 30. April 2026.
- Who is the contracting authority?
- The contracting authority is IMEC VZW.
- Which documents are needed to get started?
- Typically you need the service description, proof of eligibility, deadline notes and possibly form sheets. On Auftrag One these items are displayed in prioritized order.