Technische Universiteit EindhovenEindhovenTED
Wafer Level Reliability Tool
The delivery and installation of a Wafer Level Reliability Tool 1
Submission deadline: October 20, 2026Type: Tender
Laboratory Instruments
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Content at a glance
- Tender type:
- Tender
- Contracting authority:
- Technische Universiteit Eindhoven
- Published:
- September 06, 2026
- Deadline:
- October 20, 2026
- Topic:
- Laboratory Instruments
Tender description
The delivery and installation of a Wafer Level Reliability Tool 1
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- What is the submission deadline?
- The submission deadline is 20. Oktober 2026.
- Who is the contracting authority?
- The contracting authority is Technische Universiteit Eindhoven.
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