TEKNOLOGIAN TUTKIMUSKESKUS VTT OYVTTTED
Wafer metrology
The object of the tender was semi-automatic wafer metrology tool (later also “tool”) for measurement of total thickness, TTV (total thickness variation), warp, bow, metallization bumps, trench or via depth and geometric factors in substrates typical in semiconductor industry such as but not limited to silicon wafers, chips, stacked wafers...
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Content at a glance
- Tender type:
- Tender
- Contracting authority:
- TEKNOLOGIAN TUTKIMUSKESKUS VTT OY
- Published:
- August 30, 2026
- Deadline:
- Not specified
Tender description
The object of the tender was semi-automatic wafer metrology tool (later also “tool”) for measurement of total thickness, TTV (total thickness variation), warp, bow, metallization bumps, trench or via depth and geometric factors in substrates typical in semiconductor industry such as but not limited to silicon wafers, chips, stacked wafers, stacked chips, samples containing mixed oxides, or/and thin materials deposited. The tool had to be compatible with installation in an ISO 4 classified cleanroom. The object of the tender process was described in more detail in the invitation to tender documents.
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