Silicon Austria Labs GmbHGrazTED
Silicon Austria Labs – Laser drilling machine for fan-out wafer level packaging
The aim of this procurement procedure was to award the contract to the best bidder identified during the procurement procedure for the supply, installation and commissioning of a laser drilling machine for fan-out wafer level packaging as described below for Silicon Austria Labs GmbH.
Type: Tender
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Content at a glance
- Tender type:
- Tender
- Contracting authority:
- Silicon Austria Labs GmbH
- Published:
- August 06, 2026
- Deadline:
- Not specified
Tender description
The aim of this procurement procedure was to award the contract to the best bidder identified during the procurement procedure for the supply, installation and commissioning of a laser drilling machine for fan-out wafer level packaging as described below for Silicon Austria Labs GmbH.
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