Silicon Austria Labs GmbHGraz
Silicon Austria Labs – Chips JU: Plasma Activation system for D2W bonding
The aim of this procurement procedure was to award the contract to the best bidder identified during the procurement procedure for the supply, installation, commissioning and services (such as trainings) of a wafer-level plasma activation system for wafer bonding application for Silicon Austria Labs GmbH.
Type: Tender
Unlock documents for free
No credit card · Instant access
Content at a glance
- Tender type:
- Tender
- Contracting authority:
- Silicon Austria Labs GmbH
- Published:
- July 08, 2026
- Deadline:
- Not specified
- Contract value:
- €79,062,128
Tender description
The aim of this procurement procedure was to award the contract to the best bidder identified during the procurement procedure for the supply, installation, commissioning and services (such as trainings) of a wafer-level plasma activation system for wafer bonding application for Silicon Austria Labs GmbH.
Further details
With free access, documents, deadlines and submission notes are available in a structured format.
- Core requirements of the tender prioritized and prepared
- Deadlines, eligibility criteria and documents in one workflow
- Guidance for structured bid preparation
- Automatically discover matching follow-up tenders
Unlock 30 days free
30 days free · no credit card · cancel anytime
All procurement details
Buyer, lots, participants, locations, documents, and procedure data have already been captured. Open any area to see the complete information in your workspace.
5 data areas available
Unlock 30 days free
30 days free · no credit card · cancel anytime
Documents
Unlock1 detail capturedDocument bundle
Buyer
Unlock3 details capturedBuyer · Address · Contact
Lots
Unlock1 detail capturedLots
Procedure data
Unlock5 details capturedPublication number · Procedure reference · Procedure type · Contract type · +1 more
Performance locations
Unlock2 details capturedPerformance locations
Related tenders
10Silicon Austria Labs – Chips JU: Plasma Activation system for D2W bonding
Silicon Austria Labs GmbHGrazThe aim of this procurement procedure was to award the contract to the best bidder identified during the procurement procedure for the supply, installation, commissioning and services (such as trainings) of a wafer-level plasma activation system for wafer bonding application for Silicon Austria Labs GmbH.Silicon Austria Labs – Chips JU: Wafer Reflow Vacuum oven (manual or semi-automated)
Silicon Austria Labs GmbHGrazThe aim of this procurement procedure was to award the contract to the best bidder identified during the procurement procedure for the supply, installation and commissioning of a manual or semi-automated wafer reflow vacuum oven as well as services such as trainings for Silicon Austria Labs GmbH.Silicon Austria Labs – Frame / wafer cleaning unit
Silicon Austria Labs GmbHGrazThe aim of this procurement procedure was to award the contract to the best bidder identified during the procurement procedure for the supply, installation, commissioning as well as optional services such as trainings of a frame / wafer cleaning unit for Silicon Austria Labs GmbH.Silicon Austria Labs – Frame / wafer cleaning unit
Silicon Austria Labs GmbHGrazThe aim of this procurement procedure was to award the contract to the best bidder identified during the procurement procedure for the supply, installation, commissioning as well as optional services such as trainings of a frame / wafer cleaning unit for Silicon Austria Labs GmbH.Silicon Austria Labs – Laser drilling machine for fan-out wafer level packaging
Silicon Austria Labs GmbHGrazThe aim of this procurement procedure was to award the contract to the best bidder identified during the procurement procedure for the supply, installation and commissioning of a laser drilling machine for fan-out wafer level packaging for Silicon Austria Labs GmbH.Silicon Austria Labs – Chips JU: Total Reflection X-Ray Fluorescence Spectrometer (TXRF)
Silicon Austria Labs GmbHGrazThe aim of this procurement procedure was to award the contract to the best bidder identified during the procurement procedure for the supply, installation and commissioning of a Total Reflection X-Ray Fluorescence Spectrometer (TXRF) for Silicon Austria Labs GmbH.Silicon Austria Labs – Laser drilling machine for fan-out wafer level packaging
Silicon Austria Labs GmbHGrazThe aim of this procurement procedure was to award the contract to the best bidder identified during the procurement procedure for the supply, installation and commissioning of a laser drilling machine for fan-out wafer level packaging as described below for Silicon Austria Labs GmbH.Silicon Austria Labs – Photonic debonder (manual/ semi-automated)
Silicon Austria Labs GmbHGrazThe aim of this procurement procedure was to award the contract to the best bidder identified during the procurement procedure for the supply, installation, commissioning as well as optional services (after warranty) of a Photonic debonder (manual/ semi-automated) for Silicon Austria Labs GmbH.Silicon Austria Labs – Magnetic Wafer Prober
Silicon Austria Labs GmbHGrazDeadline: Jul 06The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation, commissioning and associated services (including documentation and trainings) of an automated magnetic wafer probing system capable of performing wafer-level electrical characterization of magnetic devices under controlled magnetic fields on semiconductor wafers up to 200 mm and optionally 300 mm in diameter at Silicon Austria Labs GmbH.Silicon Austria Labs – Chips JU: Wafer bumper
Silicon Austria Labs GmbHGrazProcurement of an automated wafer soldering bumping tool, including installation, commissioning, and training services for Silicon Austria Labs GmbH.
Frequently asked questions about this tender
- How can I apply for this tender?
- Create a free account on Auftrag One. You will then see all documents, deadlines and submission notes in a structured workflow.
- What is the submission deadline?
- No specific submission deadline is currently stated for this notice.
- Who is the contracting authority?
- The contracting authority is Silicon Austria Labs GmbH.
- Which documents are needed to get started?
- Typically you need the service description, proof of eligibility, deadline notes and possibly form sheets. On Auftrag One these items are displayed in prioritized order.