TEKNOLOGIAN TUTKIMUSKESKUS VTT OYVTTTED
Edge-Handling Sputtering Cluster Tool
The object of the tender process is an edge-handling sputtering cluster tool (later also “Equipment”). The Equipment is a sputtering cluster tool for 200-mm wafers with wafer edge-handling capability for the VTT Micronova cleanroom semiconductor front end. The procurement includes a deposition chamber with four magnetron sputtering source...
Submission deadline: August 24, 2026Type: Tender
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Content at a glance
- Tender type:
- Tender
- Contracting authority:
- TEKNOLOGIAN TUTKIMUSKESKUS VTT OY
- Published:
- August 06, 2026
- Deadline:
- August 24, 2026
Tender description
The object of the tender process is an edge-handling sputtering cluster tool (later also “Equipment”). The Equipment is a sputtering cluster tool for 200-mm wafers with wafer edge-handling capability for the VTT Micronova cleanroom semiconductor front end. The procurement includes a deposition chamber with four magnetron sputtering sources. During transport and processing, the wafers are mechanically touched only at the wafer edge, and they can be flipped in vacuum between the processes. The object of the tender process and the technical requirements are described in more detail in the invitation to tender documents.
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- The submission deadline is 24. August 2026.
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- The contracting authority is TEKNOLOGIAN TUTKIMUSKESKUS VTT OY.
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