TEKNOLOGIAN TUTKIMUSKESKUS VTT OYVTTTED
Defect inspection system
VTT is looking to acquire an automated defect inspection tool for 200 mm and 300 mm patterned wafers. The tool will enable rapid tracking of defects that appear during the manufacturing process of functional devices (in-line and end-of-line in the Front-end process). The tool must be capable of detecting particles, voids, cracks, scratche...
Submission deadline: July 28, 2026 (expired)Type: Tender
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- Tender type:
- Tender
- Contracting authority:
- TEKNOLOGIAN TUTKIMUSKESKUS VTT OY
- Published:
- June 15, 2026
- Deadline:
- July 28, 2026
Tender description
VTT is looking to acquire an automated defect inspection tool for 200 mm and 300 mm patterned wafers. The tool will enable rapid tracking of defects that appear during the manufacturing process of functional devices (in-line and end-of-line in the Front-end process). The tool must be capable of detecting particles, voids, cracks, scratches, pits, bumps, and hazes in the pattern. The materials of the patterns that the machine must be able to analyze are silicon oxides and nitrides, polysilicon, metals, and photoresist. The object of the tender process and the technical requirements are described in more detail in the invitation to tender documents.
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- The submission deadline is 28. Juli 2026.
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