University College CorkCorkTED
The Supply, Delivery and Validation of a Digital Microscope System for Tyndall National Institute, University College Cork
Tenders are required to provide a digital microscope system for advanced inspection, characterization, imaging, and dimensional analysis of electronic and microelectronic structures. The system will be used for high-resolution observation and measurement of multilayer PCB structures, integrated circuit dies, semiconductor devices, 3D-prin...
Submission deadline: July 07, 2026 (expired)Type: Tender
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- Tender type:
- Tender
- Contracting authority:
- University College Cork
- Published:
- June 15, 2026
- Deadline:
- July 07, 2026
Tender description
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Tenders are required to provide a digital microscope system for advanced inspection, characterization, imaging, and dimensional analysis of electronic and microelectronic structures. The system will be used for high-resolution observation and measurement of multilayer PCB structures, integrated circuit dies, semiconductor devices, 3D-printed electronic components, interconnects, solder joints, micro-vias, and related laboratory samples. The proposed system must provide integrated hardware and software capabilities for high-resolution imaging, 2D and 3D measurement, surface profiling, focus stacking, image stitching, tilted observation, and automated repetition of setup conditions such as image capturing and 2D/3D surface characterization. The system must operate as a fully integrated bench-top solution, including embedded computing and all software licenses required for measurement, characterization, image acquisition, analysis, and data export.
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- The submission deadline is 07. Juli 2026.
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