University College CorkCorkTED
Supply, Delivery, Installation, Commissioning, and Validation of an Integrated Glove Box-Linked Dual Atomic Layer Deposition (ALD) Reactor System with Collocated Ellipsometer System for Tyndall, UCC
Tyndall National Institute, University College Cork (UCC) invites tenders for the supply, delivery, installation, Commissioning, Calibration and Validation of an integrated Atomic Layer Deposition (ALD), Glove Box, and Ellipsometer System, compromising four main components: (i) ALD Reactor 1: Designed for the deposition of 2D dichalcogeni...
Submission deadline: July 24, 2026 (expired)Type: Tender
Laboratory Instruments, Process Technology
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Content at a glance
- Tender type:
- Tender
- Contracting authority:
- University College Cork
- Published:
- June 24, 2026
- Deadline:
- July 24, 2026
- Topic:
- Laboratory Instruments
Tender description
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Tyndall National Institute, University College Cork (UCC) invites tenders for the supply, delivery, installation, Commissioning, Calibration and Validation of an integrated Atomic Layer Deposition (ALD), Glove Box, and Ellipsometer System, compromising four main components: (i) ALD Reactor 1: Designed for the deposition of 2D dichalcogenide materials, featuring process conditions and precursor delivery systems optimised for chalcogen-based chemistries. (ii) ALD reactor 2: Configured for the deposition of metal oxide films, designed for oxygen-rich precursor processes. (iii) Glove Box Module: Provides a controlled inert atmosphere that connects both ALD reactors, enabling contamination-free sample transfer and handling. (iv) Ellipsometer: Designed to operate both in-situ and ex-situ with each ALD reactor, allowing precise thin-film thickness and optical property characterisation for process monitoring, calibration, and validation. The system must be supplied and installed by the tenderer to ensure full system integration and operational compatibility for Tyndall National Institute. Together, this integrated system will form a key capability for atomic layer processing, supporting advanced thin-film deposition and real-time characterisation for next-generation materials research.
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