Bergische Universität WuppertalTED
Rahmenvertrag Wafer und Chips
Beschaffung: Zugang zu modernen Chiptechnologien für die Entwicklung silizium-integrierter Schaltungen im Terahertz-Frequenzbereich. Anforderungen: Eignung für Hochfrequenzanwendungen, Integration von Mixed-Signal und digitalen integrierten Schaltungen. Durchführung: Lehrstuhl für Hochfrequenzsysteme in der Kommunikationstechnik (Prof. Pf...
Endpoint Devices, Accessories, Metals
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Content at a glance
- Tender type:
- Tender
- Contracting authority:
- Bergische Universität Wuppertal
- Published:
- February 26, 2026
- Deadline:
- Not specified
- Topic:
- Endpoint Devices
Tender description
Beschaffung: Zugang zu modernen Chiptechnologien für die Entwicklung silizium-integrierter Schaltungen im Terahertz-Frequenzbereich. Anforderungen: Eignung für Hochfrequenzanwendungen, Integration von Mixed-Signal und digitalen integrierten Schaltungen. Durchführung: Lehrstuhl für Hochfrequenzsysteme in der Kommunikationstechnik (Prof. Pfeiffer) im Rahmen mehrerer Forschungsprojekte.
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