Fraunhofer-Gesellschaft - Einkauf B12TED
Polymer-metal CMP (IZM-30) - PR915311-2590-P
Beschaffung eines Polymer-metal CMP Systems für 2,5D/3D-Packaging und heterogene Integration. Das System muss Wafer (Si, Glas, Halbleiter), Metalle und Dielektrika (SiO, SiN, Polymere) planarisieren. Anforderungen: Oberflächenrauhigkeit Ra ≤ 0,5 nm, Handhabung von RDL-Schichten (L/S 1µm), getrennte Kammern für Aufschlämmungen, flexibler P...
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Beschaffung eines Polymer-metal CMP Systems für 2,5D/3D-Packaging und heterogene Integration. Das System muss Wafer (Si, Glas, Halbleiter), Metalle und Dielektrika (SiO, SiN, Polymere) planarisieren. Anforderungen: Oberflächenrauhigkeit Ra ≤ 0,5 nm, Handhabung von RDL-Schichten (L/S 1µm), getrennte Kammern für Aufschlämmungen, flexible...
- Tender type:
- Tender
- Contracting authority:
- Fraunhofer-Gesellschaft - Einkauf B12
- Published:
- February 19, 2026
- Deadline:
- Not specified
Tender description
Beschaffung eines Polymer-metal CMP Systems für 2,5D/3D-Packaging und heterogene Integration. Das System muss Wafer (Si, Glas, Halbleiter), Metalle und Dielektrika (SiO, SiN, Polymere) planarisieren. Anforderungen: Oberflächenrauhigkeit Ra ≤ 0,5 nm, Handhabung von RDL-Schichten (L/S 1µm), getrennte Kammern für Aufschlämmungen, flexibler Planarisierungskopf mit variablen Druckzonen für TTV/Warpage-Kontrolle, Damaszener-Bearbeitung ohne Metallschmieren. Inkl. SECS/GEM-Schnittstelle.
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Documents and attachments
49 files recorded- PDF Notice (BUL)
- PDF Notice (SPA)
- PDF Notice (CES)
- PDF Notice (DAN)
- PDF Notice (DEU)
- PDF Notice (EST)
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