Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | IMWS vertreten durch: Fraunhofer-Institut für Mikrostruktur von Werkstoffen und Systemen IMWSHalle (Saale)TED
High resolution nano-XCT system
The Fraunhofer Institute for Microstructure of Materials and Systems IMWS researches the application behaviour, reliability, safety and lifetime of innovative materials in components and systems. The Business Unit “Electronic Materials and Components” Fraunhofer IMWS support industry and research partners by its internationally recognized...
Submission deadline: September 04, 2026Type: Tender
Laboratory Instruments
Unlock documents for free
No credit card · Instant access
Content at a glance
- Tender type:
- Tender
- Contracting authority:
- Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | IMWS vertreten durch: Fraunhofer-Institut für Mikrostruktur von Werkstoffen und Systemen IMWS
- Published:
- August 04, 2026
- Deadline:
- September 04, 2026
- Topic:
- Laboratory Instruments
Tender description
Show full descriptionCollapse description
The Fraunhofer Institute for Microstructure of Materials and Systems IMWS researches the application behaviour, reliability, safety and lifetime of innovative materials in components and systems. The Business Unit “Electronic Materials and Components” Fraunhofer IMWS support industry and research partners by its internationally recognized expertise in failure analyses of electronic components. Fraunhofer IMWS will enhance its capabilities for advanced failure analysis and material characterization to support the ramp up of new heterogenous integration technologies addressing the manufacturing and reliability challenges. To enable the non-destructive detection and evaluation of structural deviations, contact defects, damage characteristics and their most precise possible localization in the package to enable further high-resolution physical diagnostics, the latest generation of radiography (2D) and X-ray tomography (3D-CT) systems are required in particular for the non-destructive detection and evaluation of structural deviations, contact defects, damage characteristics and their most precise possible localization in the package to enable further high-resolution physical diagnostics. A high-performance multi-processor workstation is required for postprocessing of the generated imaging data sets to identify tiny deviations and defects within the devices. This tender is for the supply a functional complete device including assembly, commissioning and all necessary connections, approvals/certifications and software for operation. The requirements for a state-of-the-art x-ray inspection tool for highly integrated 2.5/3D components are described below:
Further details
With free access, documents, deadlines and submission notes are available in a structured format.
- Core requirements of the tender prioritized and prepared
- Deadlines, eligibility criteria and documents in one workflow
- Guidance for structured bid preparation
- Automatically discover matching follow-up tenders
Unlock 30 days free
30 days free · no credit card · cancel anytime
All procurement details
Buyer, lots, participants, locations, documents, and procedure data have already been captured. Open any area to see the complete information in your workspace.
6 data areas available
Unlock 30 days free
30 days free · no credit card · cancel anytime
Documents
Unlock49 details capturedDocuments
Buyer
Unlock3 details capturedBuyer · Address · Contact
Lots
Unlock1 detail capturedLots LOT-0000
Procedure data
Unlock6 details capturedPublication number · Procedure reference · Buyer reference · Procedure type · +2 more
Performance locations
Unlock3 details capturedPerformance locations
Publisher
Unlock3 details capturedPublisher · Address · Contact
Related tenders
10High resolution nano-XCT system
Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | IMWS vertreten durch: Fraunhofer-Institut für Mikrostruktur von Werkstoffen und Systemen IMWSHalle (Saale)Deadline: Sep 04The Fraunhofer Institute for Microstructure of Materials and Systems IMWS researches the application behaviour, reliability, safety and lifetime of innovative materials in components and systems. The Business Unit “Electronic Materials and Components” Fraunhofer IMWS support industry and research partners by its internationally recognized expertise in failure analyses of electronic components. Fraunhofer IMWS will enhance its capabilities for advanced failure analysis and material characterization to support the ramp up of new heterogenous integration technologies addressing the manufacturing and reliability challenges. To enable the non-destructive detection and evaluation of structural deviations, contact defects, damage characteristics and their most precise possible localization in the package to enable further high-resolution physical diagnostics, the latest generation of radiography (2D) and X-ray tomography (3D-CT) systems are required in particular for the non-destructive detection and evaluation of structural deviations, contact defects, damage characteristics and their most precise possible localization in the package to enable further high-resolution physical diagnostics. A high-performance multi-processor workstation is required for postprocessing of the generated imaging data sets to identify tiny deviations and defects within the devices. This tender is for the supply a functional complete device including assembly, commissioning and all necessary connections, approvals/certifications and software for operation. The requirements for a state-of-the-art x-ray inspection tool for highly integrated 2.5/3D components are described below:High resolution nano-XCT system
Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | IMWS vertreten durch: Fraunhofer-Institut für Mikrostruktur von Werkstoffen und Systemen IMWSHalle (Saale)Deadline: Sep 04The Fraunhofer Institute for Microstructure of Materials and Systems IMWS researches the application behaviour, reliability, safety and lifetime of innovative materials in components and systems. The Business Unit “Electronic Materials and Components” Fraunhofer IMWS support industry and research partners by its internationally recognized expertise in failure analyses of electronic components. Fraunhofer IMWS will enhance its capabilities for advanced failure analysis and material characterization to support the ramp up of new heterogenous integration technologies addressing the manufacturing and reliability challenges. To enable the non-destructive detection and evaluation of structural deviations, contact defects, damage characteristics and their most precise possible localization in the package to enable further high-resolution physical diagnostics, the latest generation of radiography (2D) and X-ray tomography (3D-CT) systems are required in particular for the non-destructive detection and evaluation of structural deviations, contact defects, damage characteristics and their most precise possible localization in the package to enable further high-resolution physical diagnostics. A high-performance multi-processor workstation is required for postprocessing of the generated imaging data sets to identify tiny deviations and defects within the devices. This tender is for the supply a functional complete device including assembly, commissioning and all necessary connections, approvals/certifications and software for operation. The requirements for a state-of-the-art x-ray inspection tool for highly integrated 2.5/3D components are described below:High resolution X-ray inspection tool
Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | IMWS vertreten durch: Fraunhofer-Institut für Mikrostruktur von Werkstoffen und Systemen IMWSHalle (Saale)Deadline: Sep 04The Fraunhofer Institute for Microstructure of Materials and Systems IMWS researches the application behaviour, reliability, safety and lifetime of innovative materials in components and systems. The Business Unit “Electronic Materials and Components” Fraunhofer IMWS support industry and research partners by its internationally recognized expertise in failure analyses of electronic components. Fraunhofer IMWS will enhance its capabilities for advanced failure analysis and material characterization to support the ramp up of new heterogenous integration technologies addressing the manufacturing and reliability challenges. To enable the non-destructive detection and evaluation of structural deviations, contact defects, damage characteristics and their most precise possible localization in the package to enable further high-resolution physical diagnostics, the latest generation of radiography (2D) and X-ray tomography (3D-CT) systems are required in particular for the non-destructive detection and evaluation of structural deviations, contact defects, damage characteristics and their most precise possible localization in the package to enable further high-resolution physical diagnostics. A high-performance multi-processor workstation is required for postprocessing of the generated imaging data sets to identify tiny deviations and defects within the devices. This tender is for the supply a functional complete device including assembly, commissioning and all necessary connections, approvals/certifications and software for operation. The requirements for a state-of-the-art x-ray inspection tool for highly integrated 2.5/3D components are described below:High resolution X-ray inspection tool
Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | IMWS vertreten durch: Fraunhofer-Institut für Mikrostruktur von Werkstoffen und Systemen IMWSHalle (Saale)Deadline: Sep 04The Fraunhofer Institute for Microstructure of Materials and Systems IMWS researches the application behaviour, reliability, safety and lifetime of innovative materials in components and systems. The Business Unit “Electronic Materials and Components” Fraunhofer IMWS support industry and research partners by its internationally recognized expertise in failure analyses of electronic components. Fraunhofer IMWS will enhance its capabilities for advanced failure analysis and material characterization to support the ramp up of new heterogenous integration technologies addressing the manufacturing and reliability challenges. To enable the non-destructive detection and evaluation of structural deviations, contact defects, damage characteristics and their most precise possible localization in the package to enable further high-resolution physical diagnostics, the latest generation of radiography (2D) and X-ray tomography (3D-CT) systems are required in particular for the non-destructive detection and evaluation of structural deviations, contact defects, damage characteristics and their most precise possible localization in the package to enable further high-resolution physical diagnostics. A high-performance multi-processor workstation is required for postprocessing of the generated imaging data sets to identify tiny deviations and defects within the devices. This tender is for the supply a functional complete device including assembly, commissioning and all necessary connections, approvals/certifications and software for operation. The requirements for a state-of-the-art x-ray inspection tool for highly integrated 2.5/3D components are described below:Precise local milling & polishing System (IMWS-07.1) - PR1068383-2690-P
Fraunhofer-Gesellschaft - Einkauf B12München1 Piece - Precise local milling & polishing System (IMWS-07.1) The Fraunhofer Institute for Microstructure of Materials and Systems IMWS researches the application behaviour, reliability, safety and lifetime of innovative materials in components and systems. The Business Unit "Electronic Materials and Components" Fraunhofer IMWS support industry and research partners by its internationally recognized expertise in failure analyses of electronic components. Fraunhofer IMWS will enhance its capabilities for advanced failure analysis and material characterization to support the ramp up of new heterogenous integration technologies addressing the manufacturing and reliability challenges. To eneable a precise mechanical preparation procedure a specialized depackaging tool is proposed. The system must be a precision grinding 5 axis CNC machine for mechanical preparation of microelectronic devices. The CNC system must be built up as and orthogonal XYZ system with the sample to prepare fixed in in XY-orientation and two additional tilt mechanisms for X- and Y-axis. To estimate the residual thickness of the milled substrate (i.e. Silicon) a second tool for measuring through the substrate is needed. This can be done optically. Because Silicon is only transparent in visible spectrum at a thickness of smaller than 1µm, an optical thickness measuring instrument in the wavelength of Infrared range and in visible range is neccessary. Options: 1.1.9. General Device Specifications Optional, the systems has to be equipped with an optical non contact measurement system to evaluate the sample orientation by three point alignment in vertical direction and a tilt compensation in both X- and Y-axis so the sample is perfectly perpendicularly oriented to the milling spindle. 1.1.11. General Device Specifications Optional: an additional sample holder must be offered 1.3.4. Spindle Specifications Optional: pneumatic or electric tool changer for fast and toolless change of milling or polishing consumables 1.5.2. Live sample control optional: additonal cameras for live inspection of milling progress 1.8.1. System for collection of dust and particles during milling process "For removal of dust and particles during dry milling processes an vacuum dust collecting system must be offered. It has to be equipped with a HEPA filter system at least of class H13. The system must operate at 230V / 50Hz." 1.8.2. System for collection of dust and particles during milling process For removal of used slurry a recirculating system for supply with fresh water or milling liquid at the milling site must be offered.Upgrade SAXS System
Institute of Science and Technology Austria (ISTA)KlosterneuburgUpgrade of a small angle X-ray scattering (SAXS) with Metal Jet source and a wide-angle detector - The first upgrade is installation of additional, stronger (higher flux) source in order to allow for high resolution small-angle measurements, in order to elucidate unambiguously determine structure of nanoparticle assemblies. The second upgrade is with additional wide-angle X-ray scattering (WAXS) detector in order to allow, in combination with current detector, for simultaneous measurement of short-range (atomic level) and long-range order.Upgrade SAXS System mit Metal Jet Quelle und Weitwinkeldetektor
Institute of Science and Technology AustriaKlosterneuburgUpgrade of a small angle X-ray scattering (SAXS) with Metal Jet source and wide-angle detector - The first upgrade is installation of additional, stronger (higher flux) source in order to allow for high resolution small-angle measurements. The second upgrade is with additional wide-angle X-ray scattering (WAXS) detector in order to allow, in combination with current detector, for simultaneous measurement of short- and long-range order.Prior Information Notice – Eddy Current Wafer Mapping System
Ferdinand-Braun-Institut gGmbH, Leibniz-Institut für HöchstfrequenztechnikBerlinDeadline: Jul 12The Ferdinand-Braun-Institut (FBH) plans to procure an eddy current wafer mapping system within the framework of the EU-funded APECS programme. The system will be used for non-destructive electrical characterisation of semiconductor wafers during processing, including sheet resistance and conductivity measurements. It is intended to support process monitoring and quality control in advanced semiconductor manufacturing. The equipment shall enable automated, high-resolution mapping of wafers up to 200 mm in diameter and provide fast feedback on process uniformity and material properties. It will be installed in a cleanroom environment and integrated into existing process workflows. The procurement procedure is planned for 2026.CON1788 Request for Tender for the Supply, Delivery, Installation and Commissioning of a High-Resolution Research grade X-ray Fluorescence (XRF) Core Scanner for University of Galway.
University of Galway (ID 1400)GalwayDeadline: Jul 23University of Galway invites tenders for the Supply, Delivery, Installation and Commissioning of a High-Resolution Research grade X-ray Fluorescence (XRF) Core Scanner The Discipline of Geography, within the School of Geography, Archaeology and Irish Studies at the University of Galway is actively engaged in research relating to sedimentary archives, including lake, marine, and peat cores, which are critical for reconstructing past environmental and climatic conditions. These research activities require high-resolution, non-destructive analytical techniques to characterise elemental composition and stratigraphy. The acquisition of an XRF core scanner will significantly enhance the Discipline’s analytical capabilities, supporting existing research programmes and enabling new avenues of investigation in environmental and archaeological sciences. The XRF core scanner system is required for the non-destructive analysis of drill cores and wet sediment cores, with elemental detection spanning magnesium (Mg) to uranium (U). The system will be used for advanced research applications in geoscience, environmental science, and related disciplines. The investment in this equipment aligns with the University of Galway’s strategic priorities in sustainability, climate action, and research excellence, and will contribute to strengthening interdisciplinary collaboration within the School and across the wider research community. Note: Tenderers must use the Tender Response Document and other documents provided by the Contracting Authority in preparing their response. The response documents must be uploaded in a ZIP file on eTenders in order to protect the integrity of file names. Please include your company name in the title of each document.Defect inspection system
TEKNOLOGIAN TUTKIMUSKESKUS VTT OYVTTDeadline: Jul 28VTT is looking to acquire an automated defect inspection tool for 200 mm and 300 mm patterned wafers. The tool will enable rapid tracking of defects that appear during the manufacturing process of functional devices (in-line and end-of-line in the Front-end process). The tool must be capable of detecting particles, voids, cracks, scratches, pits, bumps, and hazes in the pattern. The materials of the patterns that the machine must be able to analyze are silicon oxides and nitrides, polysilicon, metals, and photoresist. The object of the tender process and the technical requirements are described in more detail in the invitation to tender documents.
Frequently asked questions about this tender
- How can I apply for this tender?
- Create a free account on Auftrag One. You will then see all documents, deadlines and submission notes in a structured workflow.
- What is the submission deadline?
- The submission deadline is 04. September 2026.
- Who is the contracting authority?
- The contracting authority is Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | IMWS vertreten durch: Fraunhofer-Institut für Mikrostruktur von Werkstoffen und Systemen IMWS.
- Which documents are needed to get started?
- Typically you need the service description, proof of eligibility, deadline notes and possibly form sheets. On Auftrag One these items are displayed in prioritized order.