TEKNOLOGIAN TUTKIMUSKESKUS VTT OYVTTTED
Edge-Handling Sputtering Cluster Tool
The object of the tender process is an edge-handling sputtering cluster tool (later also “Equipment”). The Equipment is a sputtering cluster tool for 200-mm wafers with wafer edge-handling capability for the VTT Micronova cleanroom semiconductor front end. The procurement includes a deposition chamber with four magnetron sputtering source...
Angebotsfrist: 24. August 2026Typ: Ausschreibung
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- Ausschreibungstyp:
- Ausschreibung
- Auftraggeber:
- TEKNOLOGIAN TUTKIMUSKESKUS VTT OY
- Veröffentlicht:
- 06. August 2026
- Frist:
- 24. August 2026
Ausschreibungsbeschreibung
The object of the tender process is an edge-handling sputtering cluster tool (later also “Equipment”). The Equipment is a sputtering cluster tool for 200-mm wafers with wafer edge-handling capability for the VTT Micronova cleanroom semiconductor front end. The procurement includes a deposition chamber with four magnetron sputtering sources. During transport and processing, the wafers are mechanically touched only at the wafer edge, and they can be flipped in vacuum between the processes. The object of the tender process and the technical requirements are described in more detail in the invitation to tender documents.
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Häufige Fragen zu dieser Ausschreibung
- Wie kann ich mich auf diese Ausschreibung bewerben?
- Erstellen Sie ein kostenloses Konto auf Auftrag One. Danach sehen Sie alle Unterlagen, Fristen und Hinweise zur Einreichung in einem strukturierten Ablauf.
- Bis wann läuft die Angebotsfrist?
- Die Angebotsfrist endet am 24. August 2026.
- Wer ist der Auftraggeber?
- Der Auftraggeber ist TEKNOLOGIAN TUTKIMUSKESKUS VTT OY.
- Welche Unterlagen sind für den Start relevant?
- In der Regel benötigen Sie Leistungsbeschreibung, Eignungsnachweise, Fristenhinweise und ggf. Formblätter. Auf Auftrag One werden diese Punkte priorisiert dargestellt.