Fraunhofer-Gesellschaft - Einkauf B12TED
Waferreiniger / Maskenreiniger (IAF-08.3) - PR1146362-2050-P
Beschaffung eines Wafer- und Maskenreinigungsgeräts für den Einsatz in einem Reinraum der ISO-Klasse 4. Das Gerät muss Wafer und Lithographie-Masken mittels wässriger und saurer Lösungen (RCA-Prozess) von Partikeln > 250 nm reinigen. Anforderungen: Prozesskammer aus medienresistentem Material, integrierte Absaugung, Leckageerkennung sowie...
Process Technology, Water Treatment
No credit card · Instant access
Content at a glance
- Tender type:
- Tender
- Contracting authority:
- Fraunhofer-Gesellschaft - Einkauf B12
- Published:
- April 21, 2026
- Deadline:
- May 05, 2026
- Topic:
- Process Technology
Tender description
Beschaffung eines Wafer- und Maskenreinigungsgeräts für den Einsatz in einem Reinraum der ISO-Klasse 4. Das Gerät muss Wafer und Lithographie-Masken mittels wässriger und saurer Lösungen (RCA-Prozess) von Partikeln > 250 nm reinigen. Anforderungen: Prozesskammer aus medienresistentem Material, integrierte Absaugung, Leckageerkennung sowie Einhaltung europäischer Sicherheitsvorschriften für Industrieanlagen.
Further details
With free access, documents, deadlines and submission notes are available in a structured format.
- Core requirements of the tender prioritized and prepared
- Deadlines, eligibility criteria and documents in one workflow
- Guidance for structured bid preparation
- Automatically discover matching follow-up tenders
30 days free · no credit card · cancel anytime
All procurement details
Buyer, lots, participants, locations, documents, and procedure data have already been captured. Open any area to see the complete information in your workspace.
6 data areas available
30 days free · no credit card · cancel anytime
Documents
Unlock50 details capturedDocuments · Document bundle
Buyer
Unlock3 details capturedBuyer · Address · Contact
Lots
Unlock1 detail capturedLots LOT-0000
Procedure data
Unlock6 details capturedPublication number · Procedure reference · Buyer reference · Procedure type · +2 more
Performance locations
Unlock2 details capturedPerformance locations
Publisher
Unlock6 details capturedPublisher · Address · Contact
Related tenders
4Wafer cleaner / mask cleaner (IAF-08.3) - PR1146362-2050-P
Fraunhofer-Gesellschaft - Einkauf B12Wafer cleaner / mask cleaner (IAF-08.3) The requirement is for a wafer and mask cleaning machine to be installed in an ISO Class 4 cleanroom and which must comply with European safety regulations for industrial equipment. The system is intended to remove particles and contaminants from wafers and lithography masks using aqueous and acidic solutions, based on the RCA cleaning process. To ensure safe operation and a long service life, the process chamber must be made of process-media-resistant material and be equipped with an extraction system and leak detection. The system must be capable of reliably removing particles larger than 250 nm from (quartz) glass or wafers in order to ensure the purity required for the processes in the Fraunhofer IAF cleanroom and not to compromise process yield. Translated with DeepL.com (free version)Evaporation System (IAF-06.1) - PR1197813-2050-P
Fraunhofer-Gesellschaft - Einkauf B12Deadline: Jun 081 Evaporation System: Elektronenstrahl-Verdampfungsanlage für die Metallbeschichtung, geeignet für 150-mm-Wafer, wassergekühlte Hochvakuum-Beschichtungsanlage für Metallabscheidung im vertikalen und schrägen Winkel (Substrat um 45 Grad geneigt).ICP Trockenätzanlage Chlor IV (IAF-07b1) - PR1119209-2050-P
Fraunhofer-Gesellschaft - Einkauf B121 Stück Chlor ICP-Ätzanlage mit planarer Plasmaquelle, die bestehende qualifizierte Ätzprozesse (Sentech ICP-RIE SI500 537) direkt übernehmen kann, übertragbar auf 150mm Wafer. Optionen: Substratelektroden für 100mm/75mm Wafer und Bruchstücke, beheizter Liner, Serviceerweiterung, Ersatzteilkits (Gasring, MVV-Messröhre, Schalldämpfer, Turbopumpe, Koppelplatte, Clamping 150mm, Umlaufkühler Julabo, SPS-Steuereinheit).Prober 300mm (IAF-09.3) - PR971253-2050-P
Fraunhofer-Gesellschaft - Einkauf B122 pieces: Prober 300mm For the automated characterization of circuits in the millimetre wave range up to approx. 250 GHz by means of S-parameter and power measurements, two wafer probers are required that meet the highest requirements for positioning accuracy. Contact areas ("pads") of approx. 10µm must be able to be approached precisely and with high reproducibility over a "wafer" area of ø300 mm. As the height of these wafers can vary by approx. ±10µm, automatic height correction (Z-profiling) is required. Temperature control of the chuck is necessary.
Frequently asked questions about this tender
- How can I apply for this tender?
- Create a free account on Auftrag One. You will then see all documents, deadlines and submission notes in a structured workflow.
- What is the submission deadline?
- The submission deadline is 05. Mai 2026.
- Who is the contracting authority?
- The contracting authority is Fraunhofer-Gesellschaft - Einkauf B12.
- Which documents are needed to get started?
- Typically you need the service description, proof of eligibility, deadline notes and possibly form sheets. On Auftrag One these items are displayed in prioritized order.