IFW Dresden e. V.DresdenTED
Modular Thin-Film Vacuum Deposition System with Glovebox
Modular Thin-Film Vacuum Deposition System with Glovebox
Laboratory Instruments, Process Technology
No credit card · Instant access
Content at a glance
- Tender type:
- Tender
- Contracting authority:
- IFW Dresden e. V.
- Published:
- August 11, 2026
- Deadline:
- September 15, 2026
- Topic:
- Laboratory Instruments
Tender description
Modular Thin-Film Vacuum Deposition System with Glovebox
Further details
With free access, documents, deadlines and submission notes are available in a structured format.
- Core requirements of the tender prioritized and prepared
- Deadlines, eligibility criteria and documents in one workflow
- Guidance for structured bid preparation
- Automatically discover matching follow-up tenders
30 days free · no credit card · cancel anytime
All procurement details
Buyer, lots, participants, locations, documents, and procedure data have already been captured. Open any area to see the complete information in your workspace.
6 data areas available
30 days free · no credit card · cancel anytime
Documents
Unlock49 details capturedDocuments
Buyer
Unlock6 details capturedBuyer · Address · Contact
Lots
Unlock1 detail capturedLots LOT-0001
Procedure data
Unlock6 details capturedPublication number · Procedure reference · Buyer reference · Procedure type · +2 more
Performance locations
Unlock2 details capturedPerformance locations
Publisher
Unlock6 details capturedPublisher · Address · Contact
Related tenders
8Silicon Austria Labs – Upgrades for magnetic thin film sputtering deposition equipment
Silicon Austria Labs GmbHGrazThe aim of this procurement procedure was to award the contract to the best bidder identified during the procurement procedure for the supply, installation, commissioning, and associated services (including documentation and trainings) of modules enabling the extension of the range of process capabilities related to the sputtering deposition of magnetic thin films and multilayers for Silicon Austria Labs GmbH.LA3215C-UCC-CFT for the Supply of a Suite of Plasma Etcher and Plasma Deposition Tools, 4 Lots
Education Procurement Service (EPS)LimerickDeadline: Jul 24Tenders are sought for the supply delivery, installation and commissioning of a suite of tools in 4 Lots for silicon-based and dielectric materials for University College Cork. The new plasma tools will enhance the capabilities at the Tyndall National Institute for the fabrication of semiconductor devices, especially silicon microelectronics and silicon MEMS, but also other materials such as germanium and silicon carbide. We invite proposals for the following lots; Lot 1 Plasma Etcher Silicon Dielectrics, advanced plasma etching system capable of etching for polysilicon poly-Si silicon dioxide SiO2 silicon nitride SiN thin films using medium high-density plasma processes. Lot 2 Plasma Etcher Metals Piezoelectrics, advanced plasma etching system capable of etching for aluminium Al and alloys molybdenum Mo aluminium scandium nitride AlScN thin films using medium high-density plasma processes. Lot 3 Plasma Etcher Slow and Controllable Rate Atomic Layer Etch for Silicon Dielectrics, advanced plasma etching system capable of both conventional high-rate etching and slow and controllable rate atomic layer etching for silicon Si silicon dioxide SiO2 silicon nitride SiN thin films using medium high-density plasma processes. Lot 4 Plasma Deposition PECVD, advanced plasma enhanced chemical vapour deposition system capable of depositing dielectric SiO2, SiN and amorphous a-Si thin films on semiconductor substrates. This equipment will be essential for etching and depositing a range of materials used in the fabrication of silicon microelectronics, silicon photonics and silicon MEMS devices. The ideal tools will offer precision, reliability, and efficiency to meet the requirements for etching and deposition on both 100 mm and 200 mm diameter wafers. Tenderers with cutting-edge solutions that can achieve these high standards are encouraged to submit their proposals for this vital component in our technological advancement.Deposition Tool 8 Inch
Freistaat Bayern vertreten durch die Technische Universität München, hier handelnd die Forschungs-Neutronenquelle Heinz Maier-Leibnitz (FRM II)GarchingDeadline: Oct 05The Technical University of Munich - Chair of Technical Physics E23/WMI will acquire a UHV cluster System for the fabrication of superconducting circuits on 8 inch'' wafers. The system must provide UHV conditions and has to include an HV load-lock chamber, a central handling chamber, a UHV chamber for the evaporation of Al thin films, a UHV chamber for sputtering of superconductors, a UHV chamber for oxidation, a UHV chamber for Ar ion milling, and a flipping station. The system must allow metalizing both sides of the wafers in situ, with minimal backside particle contamination. The wafers should only be touched on the side (edge gripping).Eine automatisierte Hochdurchsatz-Plattform für Whole-Slide-Imaging
EPFL-Scientific EquipmentLausanneDeadline: Sep 08Die EPFL beabsichtigt, eine automatisierte Hochdurchsatz-Plattform fuer Whole-Slide-Imaging fuer das Labor UPCOURTINE (NeuroRestore), Fakultaet fuer Lebenswissenschaften (SV), am Campus Biotech Genf zu erwerben. Das System wird der quantitativen digitalen Histologie, der multiplexen Fluoreszenzmikroskopie, der raeumlichen Biologie und der grossskaligen Gewebeanalyse in den Bereichen Neurowissenschaften, regenerative Medizin, Krebsbiologie und verwandte biomedizinische Forschung dienen. Die Ausruestung muss automatisiertes Hellfeld- und Fluoreszenzscanning grosser Objekttraegerchargen, reproduzierbare Whole-Slide-Digitalisierung, Mehrkanalbildgebung, hochaufloesende Erfassung, robustes Stitching, Datenexport und eine benutzerfreundliche Bedienung durch geschulte Forschende ermoeglichen. Varianten sind zugelassen, sofern sie gleichwertige oder bessere Leistungen bieten und alle nachstehend beschriebenen obligatorischen funktionalen Anforderungen erfuellen.Pipettierroboter
AGES - Österreichische Agentur für Gesundheit und Ernährungssicherheit GmbHWienGegenstand der Ausschreibung ist die Lieferung, Montage, Installation und Inbetriebnahme eines fabrikneuen NGS Library Preparation Pipettierroboters der neuesten Generation.DFG-Az.: SFB 1277/4 C05 (A 178) Lieferung eines Cryogenic Device-Chip Probers
Deutsche Forschungsgemeinschaft e.V.BonnDeadline: Aug 14Lieferung eines Gerätesystems gem. beigefügter Leistungsbeschreibung. DFG-Az.: SFB 1277/4 C05 (A 178) Lieferung eines Cryogenic Device-Chip ProbersBeschaffung Ramam microscope
Max-Planck-Institut für Intelligente SystemeStuttgartDeadline: Sep 01Bietercockpit“. Die Nutzung dieser Software ist Gegenstand einer gesonderten Nutzungsvereinbarung. Der Benutzer erwirbt außerhalb der bestimmungsgemä- ßen Nutzung der Software bei Vergabeverfahren auf der Vergabeplattform kei- nerlei weitere Rechte an der Software.26-011.451 FPLC Akta pure 25 Chromatographiesystem
Universität WienWienBeschaffung eines FPLC AKTA pure 25 M Chromatographiesystem inkl. Zubehör für das Dekanat der Fakultät Chemie.
Frequently asked questions about this tender
- How can I apply for this tender?
- Create a free account on Auftrag One. You will then see all documents, deadlines and submission notes in a structured workflow.
- What is the submission deadline?
- The submission deadline is 15. September 2026.
- Who is the contracting authority?
- The contracting authority is IFW Dresden e. V..
- Which documents are needed to get started?
- Typically you need the service description, proof of eligibility, deadline notes and possibly form sheets. On Auftrag One these items are displayed in prioritized order.