Silicon Austria Labs GmbHGrazTED
Silicon Austria Labs – Laser drilling machine for fan-out wafer level packaging
The aim of this procurement procedure was to award the contract to the best bidder identified during the procurement procedure for the supply, installation and commissioning of a laser drilling machine for fan-out wafer level packaging as described below for Silicon Austria Labs GmbH.
Typ: Ausschreibung
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Inhalt auf einen Blick
- Ausschreibungstyp:
- Ausschreibung
- Auftraggeber:
- Silicon Austria Labs GmbH
- Veröffentlicht:
- 06. August 2026
- Frist:
- Nicht angegeben
Ausschreibungsbeschreibung
The aim of this procurement procedure was to award the contract to the best bidder identified during the procurement procedure for the supply, installation and commissioning of a laser drilling machine for fan-out wafer level packaging as described below for Silicon Austria Labs GmbH.
Weiterführende Details
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Häufige Fragen zu dieser Ausschreibung
- Wie kann ich mich auf diese Ausschreibung bewerben?
- Erstellen Sie ein kostenloses Konto auf Auftrag One. Danach sehen Sie alle Unterlagen, Fristen und Hinweise zur Einreichung in einem strukturierten Ablauf.
- Bis wann läuft die Angebotsfrist?
- Für diese Bekanntmachung ist aktuell keine konkrete Angebotsfrist angegeben.
- Wer ist der Auftraggeber?
- Der Auftraggeber ist Silicon Austria Labs GmbH.
- Welche Unterlagen sind für den Start relevant?
- In der Regel benötigen Sie Leistungsbeschreibung, Eignungsnachweise, Fristenhinweise und ggf. Formblätter. Auf Auftrag One werden diese Punkte priorisiert dargestellt.