FAIR - Facility for Antiproton and Ion Research in Europe GmbHDarmstadt
Flip Chip Die Bonder
Flip Chip Die Bonder In flip-chip assembly, a semiconductor chip is electrically connected directly underside to a sensor via contact bumps. This requires a flip-chip die bonder, which places the chips flipped on the sensors with micrometer precision and enables various bonding technologies such as soldering, thermal bonding, and conducti...
Angebotsfrist: 21. September 2026Typ: Ausschreibung
Messtechnik, Laborinstrumente, Verfahrenstechnik
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Inhalt auf einen Blick
- Ausschreibungstyp:
- Ausschreibung
- Auftraggeber:
- FAIR - Facility for Antiproton and Ion Research in Europe GmbH
- Veröffentlicht:
- 22. August 2026
- Frist:
- 21. September 2026
- Thema:
- Messtechnik
Ausschreibungsbeschreibung
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Flip Chip Die Bonder In flip-chip assembly, a semiconductor chip is electrically connected directly underside to a sensor via contact bumps. This requires a flip-chip die bonder, which places the chips flipped on the sensors with micrometer precision and enables various bonding technologies such as soldering, thermal bonding, and conductive adhesive bonding. Flip Chip Die Bonder The Flip-chip Die bonder should include the following process modules: - Precision die bonding (face up) - Flip chip bonding (face down) - adapted system work table - chip and substrate heating with process gas enclosure - software-controlled bonding force module - ultrasonic bonding module - in-situ-monitoring with video camera - form generator for creating reference elements for face up alignment - tool tip changing module - three different tool tips - tool tip support including heater - dispenser module for paste and liquids - UV-curing module - die-eject module
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- Bis wann läuft die Angebotsfrist?
- Die Angebotsfrist endet am 21. September 2026.
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- Der Auftraggeber ist FAIR - Facility for Antiproton and Ion Research in Europe GmbH.
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