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Silicon Austria Labs GmbHGrazTED

Silicon Austria Labs – Chips JU: Plasma Activation system for D2W bonding

Beschaffung eines Wafer-Level-Plasmaaktivierungssystems für Wafer-Bonding-Anwendungen bei der Silicon Austria Labs GmbH. Der Auftrag umfasst die Lieferung, Installation, Inbetriebnahme sowie begleitende Dienstleistungen, insbesondere Schulungen.

Submission deadline: March 31, 2026 (expired)Type: Tender
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Content at a glance

Tender type:
Tender
Contracting authority:
Silicon Austria Labs GmbH
Published:
March 23, 2026
Deadline:
March 31, 2026

Tender description

Beschaffung eines Wafer-Level-Plasmaaktivierungssystems für Wafer-Bonding-Anwendungen bei der Silicon Austria Labs GmbH. Der Auftrag umfasst die Lieferung, Installation, Inbetriebnahme sowie begleitende Dienstleistungen, insbesondere Schulungen.

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Create a free account on Auftrag One. You will then see all documents, deadlines and submission notes in a structured workflow.
What is the submission deadline?
The submission deadline is 31. März 2026.
Who is the contracting authority?
The contracting authority is Silicon Austria Labs GmbH.
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Typically you need the service description, proof of eligibility, deadline notes and possibly form sheets. On Auftrag One these items are displayed in prioritized order.
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Deadline tracked until March 31, 2026No credit card required