Fraunhofer-Gesellschaft - Einkauf B12TED
Fully Automated Wafer Cleaning Tool (IZM-130) - PR1097493-3460-P
Vollautomatisches Nasswerkzeug zur Reinigung und optionalen Ätzung von Wafer-Substraten (200/300 mm, Si/Glas, Dicke bis 2,5 mm). Entfernt organische/anorganische Verunreinigungen, z.B. für TSVs mit Aspektverhältnis bis 25:1, ultrahochdichte BEOL, Cu/Cu-Hybridverbindungen. Anforderungen: Partikel <1 μm, Metallkontamination <10^9 Atomen/cm²...
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Content at a glance
- Tender type:
- Tender
- Contracting authority:
- Fraunhofer-Gesellschaft - Einkauf B12
- Published:
- May 12, 2026
- Deadline:
- Not specified
Tender description
Vollautomatisches Nasswerkzeug zur Reinigung und optionalen Ätzung von Wafer-Substraten (200/300 mm, Si/Glas, Dicke bis 2,5 mm). Entfernt organische/anorganische Verunreinigungen, z.B. für TSVs mit Aspektverhältnis bis 25:1, ultrahochdichte BEOL, Cu/Cu-Hybridverbindungen. Anforderungen: Partikel <1 μm, Metallkontamination <10^9 Atomen/cm², Rauheit <5 Å. Kompatibel mit stark verzogenen Wafern. Automatisiert: Entladen aus FOUP, Wenden, Nassprozesse, Rückladen. Rezepturprogrammierung für F&E. Inklusive Chemikalienschrank. Optionen: Waferdicke 300–600 μm, Verzug 1500–2500 μm, anorganischer Ätzprozess.
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