FAIR - Facility for Antiproton and Ion Research in Europe GmbHDarmstadt
Flip Chip Die Bonder
Flip Chip Die Bonder In flip-chip assembly, a semiconductor chip is electrically connected directly underside to a sensor via contact bumps. This requires a flip-chip die bonder, which places the chips flipped on the sensors with micrometer precision and enables various bonding technologies such as soldering, thermal bonding, and conducti...
Submission deadline: September 21, 2026Type: Tender
Measurement Technology, Laboratory Instruments, Process Technology
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Content at a glance
- Tender type:
- Tender
- Contracting authority:
- FAIR - Facility for Antiproton and Ion Research in Europe GmbH
- Published:
- August 22, 2026
- Deadline:
- September 21, 2026
- Topic:
- Measurement Technology
Tender description
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Flip Chip Die Bonder In flip-chip assembly, a semiconductor chip is electrically connected directly underside to a sensor via contact bumps. This requires a flip-chip die bonder, which places the chips flipped on the sensors with micrometer precision and enables various bonding technologies such as soldering, thermal bonding, and conductive adhesive bonding. Flip Chip Die Bonder The Flip-chip Die bonder should include the following process modules: - Precision die bonding (face up) - Flip chip bonding (face down) - adapted system work table - chip and substrate heating with process gas enclosure - software-controlled bonding force module - ultrasonic bonding module - in-situ-monitoring with video camera - form generator for creating reference elements for face up alignment - tool tip changing module - three different tool tips - tool tip support including heater - dispenser module for paste and liquids - UV-curing module - die-eject module
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- The submission deadline is 21. September 2026.
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