Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. - Einkauf B12 - Vergabestelle BauMünchenTED
Die-to-Wafer Bonder (IPMS-MRS14.1) - PR922727-2480-P
1 Stück -Die-to-Wafer Bonder (IPMS-MRS14.1) Option 1 (LV Pos. 1.13): Please offer an extended warranty of further 12 months (in total 24 month) Option 2 (LV Pos. 3.6): The tool should handle wafers with the size of (source and target) Option 3 (LV Pos. 3.14): The chiplets can be picked from this type of tray (source) Option 4 (LV Pos. 4.1...
Laboratory Instruments, Process Technology
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Content at a glance
- Tender type:
- Tender
- Contracting authority:
- Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. - Einkauf B12 - Vergabestelle Bau
- Published:
- June 24, 2026
- Deadline:
- July 24, 2026
- Topic:
- Laboratory Instruments
Tender description
1 Stück -Die-to-Wafer Bonder (IPMS-MRS14.1) Option 1 (LV Pos. 1.13): Please offer an extended warranty of further 12 months (in total 24 month) Option 2 (LV Pos. 3.6): The tool should handle wafers with the size of (source and target) Option 3 (LV Pos. 3.14): The chiplets can be picked from this type of tray (source) Option 4 (LV Pos. 4.1): The system can be controlled using SECS-GEM commands. The following protocols must be supported: E30, E5, E37 and E10. Alternatively, a proprietary but completely documented communication interface has to be provided.
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- The submission deadline is 24. Juli 2026.
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